Electronic Manufacturing Services
Aeroflex Microelectronic Solutions’ Electronic Manufacturing Services (EMS) has achieved Category 1A Trusted Accreditation by the Department of Defense. We offer a broad range of products and services from design through turnkey assembly, including a full suite of testing and screening services with full ITAR compliance.
For questions, please call 800-645-8862.
Circuit Card Assembly, Aeroflex Colorado Springs
- Assembly processes for both ANSI-J-STD-001 including DS/ES and NASA 8739
- ISO 9001:2008 certified with AS9100:2004 Rev C value-added compliance
- ESD Certified to ANSI-ESD S20.20 for assemblies and Integrated Circuits
- Environmental and quality control systems. Colorado “Gold” award winner
- Turnkey or consigned board assembly/manufacturing
- Counterfeit Parts Control and Obsolescence/EOL Parts Management Programs
- Automated Surface Mount and Plated Through-Hole Board Assembly
- Qualified Ceramic Column Grid Array (CGA) Packaging
- System and Level Board testing
Custom Hybrid, MCM, Module, Box Assembly and Testing Services, Aeroflex Plainview
- Space & MIL Qualified Assembly Services – Certified Class K per MIL-PRF-38534
- Vertically Integrated Die to Box Facility
- DoD Microelectronics Trusted Source, Category 1A
- Quick turn capable
- ISO 9001 and AS9100:2004 certified
- Element evaluation and component screening
- Class 10,000 clean room for thick film substrate manufacturing
- Class 100,000 clean room for hybrid, SMT and box assembly
- High Reliability Chip on Board Design & Manufacturing Services
- Full turnkey “Design to Spec” services for SMT Assemblies & Boxes
- RF / MW Manufacturing Services for High Volume Phased Array Antennas
- White Paper: A Candidate DC-DC Converter for Hi Rel
Radiation Effects Test and Support, Aeroflex RAD
- MIL-STD Radiation Effects Test Services
- High and Low Dose Co60 Gamma Tests
- Neutron Displacement Damage Testing
- Single Event Effects Testing (SEL,SET,SEU,SEFI,SEGR)
- Device Preparation for Single Event Effects (SEE) Testing
- Flash X-Ray Prompt Pulse
- Device Screening and Element Evaluation
- Quick-Turn Prototype IC Assembly and Chip Removal and Re-assembly for RAD Testing
- Backside Chip Thinning and Re-assembly for Heavy Ion Radiation testing
- Radiation Test Engineering support including circuit design, test plan development and test result reports
- PC Board Design, Quick-Turn Prototyping and Assembly as well as Laser Marking and Cutting
Accreditation of Trust