Aeroflex Microelectronic Solutions

From GaAs to silicon. No one provides a more comprehensive approach to handling all your requests for standard and custom Schottkys, PINs, NIPs, varactors, detectors, limiters, capacitors, resistors, inductors, attenuator pads, and so much more. And they come delivered every way imaginable, from wafers to plastic surface mount.

Aeroflex Metelics Products

Lab Testing Services

Aeroflex / Metelics offer a full range of test services to meet the most demanding customer application requirements. Our facility is DSCC and ISO9001:2008 certified to up-screen semiconductor devices to JAN, JANTX, JANTXV and JANS quality levels. We also offer an extensive array of capabilities including custom design, assembly, screening and final processing to your specifications.

The Defense Supply Center Columbus has deemed Aeroflex / Metelics’ facility suitably equipped to perform qualification and conformance inspection along with screening tests to MIL-PRF-19500 for the following:

MIL-STD-750 Test Methods
MethodTitle
1022 Resistance to solvents
1026 Steady-state operation life
1027 Steady-state operation life (sample plan)
1032 High-temperature (nonoperating) life (sample plan)
1037 Intermittent operation life (sample plan)
1038 Burn-in (for diodes, rectifiers, and zeners)
1039 Burn-in (for transistors)
1051 Temperature cycling (air to air)
1054 Potted environment stress test
1056 Thermal shock (liquid to liquid)
1057 Resistance to Glass Cracking
1071 Hermetic seal
2026 Solderability
2031 Resistance to soldering heat
2036 Terminal strength
2052 Particle impact noise detection (PIND) test
2066 Physical dimensions
2068 External visual for nontransparent, glass-encased,
double plug, noncavity, axial leaded diodes
2071 Visual and mechanical examination
2072 Internal visual transistor (pre-cap) inspection
2073 Internal inspection for die (semiconductor diode)
2074 Internal visual inspection (discrete semiconductor diodes)
2075 Decap internal visual design verification
2101 DPA procedures for diodes
3001 Breakdown voltage, collector to base
3011 Breakdown voltage, collector to emitter
3036 Collector to base cutoff current
3041 Collector to emitter cutoff current
3051 Safe operating area (continuous dc)
3061 Emitter to base cutoff current
3066 Base emitter voltage (saturated or nonsaturated)
3071 Saturation voltage and resistance
3076 Forward-current transfer ratio
3100 Junction temperature measurement
3101 Thermal impedance testing of diodes
3201 Small-signal short-circuit input impedance
3206 Small-signal short-circuit forward-current transfer ratio
3211 Small-signal open-circuit reverse-voltage transfer ratio
3216 Small-signal open-circuit output admittance
3236 Open circuit output capacitance
3240 Input capacitance (output open-circuited or short-circuited)
3251 Pulse response
3401 Breakdown voltage, gate to source
3403 Gate to source voltage or current
3405 Drain to source on-state voltage
3407 Breakdown voltage, drain to source
3411 Gate reverse current
3413 Drain current
3421 Static drain to source on-state resistance
3423 Small-signal, drain to source on state resistance
4001 Capacitance
4011 Forward voltage
4016 Reverse current leakage
4021 Breakdown voltage (diodes)
4022 Breakdown voltage (voltage regulators and voltage-reference diodes)
4023 Scope display
4026 Forwardrecovery voltage and time
4031 Reverse recovery characteristics
4051 Small-signal reverse breakdown impedance
4066 Surge current
4071 Temperature coefficient of breakdown voltage
4081 Thermal resistance of lead mounted diodes
(forward voltage, switching method)
4201 Holding current
4206 Forward blocking current
4211 Reverse blocking current
4219 Reverse gate current
4221 Gate-trigger voltage or gate-trigger current
4226 Forward "on" voltage